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  17. <description>Connecting The Global Electronics Industry</description>
  18. <lastBuildDate>Sat, 04 May 2024 01:30:38 +0000</lastBuildDate>
  19. <pubDate>Sat, 04 May 2024 01:30:38 +0000</pubDate>
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  31. <title>Arm Brings Transformers to IoT Devices</title>
  32. <link>https://www.eetimes.com/arm-brings-transformers-to-iot-devices/</link>
  33.  
  34. <comments>https://www.eetimes.com/arm-brings-transformers-to-iot-devices/#respond</comments>
  36. <dc:creator>
  37. <![CDATA[Sally Ward-Foxton]]>
  38. </dc:creator>
  39. <pubDate>Sat, 04 May 2024 14:00:26 +0000</pubDate>
  40. <category><![CDATA[News]]></category>
  41. <category><![CDATA[AI and Big Data]]></category>
  42. <guid isPermaLink="false">https://www.eetimes.com/?p=1415048</guid>
  43. <description>
  44. <![CDATA[<p>Arm's Ethos microNPU supports tiny transformers, including TinyLlama-1.1B.</p>
  45. <p>The post <a href="https://www.eetimes.com/arm-brings-transformers-to-iot-devices/">Arm Brings Transformers to IoT Devices</a> appeared first on <a href="https://www.eetimes.com">EE Times</a>.</p>
  46. ]]>
  47. </description>
  48.  
  50. <content:encoded>
  51. <![CDATA[<p><em>NUREMBERG, Germany—</em>The next generation of Arm’s Ethos micro-NPU, Ethos-U85, is designed to support transformer operations, bringing generative AI models to IoT devices. The IP giant is seeing demand for</p>]]>
  52. </content:encoded>
  54. <dc:language>en-US</dc:language>
  55.  
  56. <media:thumbnail url="https://www.eetimes.com/wp-content/uploads/tinyllama.jpg" />
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  62. <post-id xmlns="com-wordpress:feed-additions:1">1415048</post-id> </item>
  63. <item>
  64. <title>AMD Updates AI Engine In New Versal Series</title>
  65. <link>https://www.eetimes.com/amd-updates-ai-engine-in-new-versal-series/</link>
  66.  
  67. <comments>https://www.eetimes.com/amd-updates-ai-engine-in-new-versal-series/#respond</comments>
  69. <dc:creator>
  70. <![CDATA[Sally Ward-Foxton]]>
  71. </dc:creator>
  72. <pubDate>Thu, 02 May 2024 18:00:29 +0000</pubDate>
  73. <category><![CDATA[News]]></category>
  74. <category><![CDATA[AI and Big Data]]></category>
  75. <guid isPermaLink="false">https://www.eetimes.com/?p=1415017</guid>
  76. <description>
  77. <![CDATA[<p>Putting pre-processing, AI inference and post-processing on the same chip avoids using multiple chips.</p>
  78. <p>The post <a href="https://www.eetimes.com/amd-updates-ai-engine-in-new-versal-series/">AMD Updates AI Engine In New Versal Series</a> appeared first on <a href="https://www.eetimes.com">EE Times</a>.</p>
  79. ]]>
  80. </description>
  81.  
  83. <content:encoded>
  84. <![CDATA[<p><em>NUREMBERG, Germany—</em>AMD has updated the AI Engine in its second-generation Versal AI Edge Series Gen 2, and has added post-processing capabilities to put an application’s entire data path on a single</p>]]>
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  92. <slash:comments>0</slash:comments>
  95. <post-id xmlns="com-wordpress:feed-additions:1">1415017</post-id> </item>
  96. <item>
  97. <title>University Center on Alert for Bias as AI Spreads</title>
  98. <link>https://www.eetimes.com/university-center-on-alert-for-bias-as-ai-spreads/</link>
  99.  
  100. <comments>https://www.eetimes.com/university-center-on-alert-for-bias-as-ai-spreads/#respond</comments>
  102. <dc:creator>
  103. <![CDATA[Ilene Wolff]]>
  104. </dc:creator>
  105. <pubDate>Thu, 02 May 2024 12:30:22 +0000</pubDate>
  106. <category><![CDATA[News]]></category>
  107. <category><![CDATA[AI]]></category>
  108. <category><![CDATA[AI and Big Data]]></category>
  109. <category><![CDATA[AI and ML]]></category>
  110. <category><![CDATA[Artificial Intelligence (AI)]]></category>
  111. <category><![CDATA[chatGPT]]></category>
  112. <category><![CDATA[Diversity and Belonging in EE]]></category>
  113. <guid isPermaLink="false"></guid>
  114. <description>
  115. <![CDATA[<p>Exploring how conversational AI can avoid partiality. </p>
  116. <p>The post <a href="https://www.eetimes.com/university-center-on-alert-for-bias-as-ai-spreads/">University Center on Alert for Bias as AI Spreads</a> appeared first on <a href="https://www.eetimes.com">EE Times</a>.</p>
  117. ]]>
  118. </description>
  119.  
  121. <content:encoded>
  122. <![CDATA[<p><span style="font-weight: 400">As Kofi Nyarko witnessed “AI eating the world” a few years ago, one issue pestered him.</span></p>
  123. <figure id="attachment_1414961" aria-describedby="caption-attachment-1414961" style="width: 201px" class="wp-caption alignleft"><a href="https://www.eetimes.com/wp-content/uploads/Kofi_Nyarko.jpeg"><img loading="lazy" class=" wp-image-1414961" src="https://www.eetimes.com/wp-content/uploads/Kofi_Nyarko.jpeg?w=434&#038;resize=201%2C248" alt="" width="201" height="248" data-recalc-dims="1" /></a><figcaption id="caption-attachment-1414961" class="wp-caption-text">Kofi Nyarko (Source: Morgan State University)</figcaption></figure>
  124. <p><span style="font-weight: 400">“The research into AI at that time was geared toward the metrics of</span></p>]]>
  125. </content:encoded>
  127. <dc:language>en-US</dc:language>
  128.  
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  132. <slash:comments>0</slash:comments>
  135. <post-id xmlns="com-wordpress:feed-additions:1">1414959</post-id> </item>
  136. <item>
  137. <title>Unlocking the Power of Multi-Level BOMs in Electronics Production </title>
  138. <link>https://www.eetimes.com/unlocking-the-power-of-multi-level-boms-in-electronics-production/</link>
  139.  
  140. <comments>https://www.eetimes.com/unlocking-the-power-of-multi-level-boms-in-electronics-production/#respond</comments>
  142. <dc:creator>
  143. <![CDATA[MRPeasy]]>
  144. </dc:creator>
  145. <pubDate>Thu, 02 May 2024 01:11:26 +0000</pubDate>
  146. <category><![CDATA[Sponsored content]]></category>
  147. <category><![CDATA[Components]]></category>
  148. <category><![CDATA[electronic components]]></category>
  149. <category><![CDATA[production]]></category>
  150. <category><![CDATA[semiconductor components]]></category>
  151. <category><![CDATA[supply chain]]></category>
  152. <category><![CDATA[Supply Chain Management]]></category>
  153. <guid isPermaLink="false">https://www.eetimes.com/?p=1415033</guid>
  154. <description>
  155. <![CDATA[<p>This type of BOM becomes indispensable when a certain level of product complexity is reached. </p>
  156. <p>The post <a href="https://www.eetimes.com/unlocking-the-power-of-multi-level-boms-in-electronics-production/">Unlocking the Power of Multi-Level BOMs in Electronics Production </a> appeared first on <a href="https://www.eetimes.com">EE Times</a>.</p>
  157. ]]>
  158. </description>
  159.  
  161. <content:encoded>
  162. <![CDATA[<p><span data-contrast="auto">A multi-level BOM is a bill of materials that represents the composition of various subassemblies in addition to the final product. This type of BOM becomes indispensable when a certain level of product</span></p>]]>
  163. </content:encoded>
  165. <dc:language>en-US</dc:language>
  166.  
  167. <media:thumbnail url="https://www.eetimes.com/wp-content/uploads/MRPeasy-Logo-600x340-3.jpg" />
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  170. <slash:comments>0</slash:comments>
  173. <post-id xmlns="com-wordpress:feed-additions:1">1415033</post-id> </item>
  174. <item>
  175. <title>Smarter MCUs Keep AI at the Edge</title>
  176. <link>https://www.eetimes.com/smarter-mcus-keep-ai-at-the-edge/</link>
  177.  
  178. <comments>https://www.eetimes.com/smarter-mcus-keep-ai-at-the-edge/#respond</comments>
  180. <dc:creator>
  181. <![CDATA[Gary Hilson]]>
  182. </dc:creator>
  183. <pubDate>Wed, 01 May 2024 18:00:26 +0000</pubDate>
  184. <category><![CDATA[News]]></category>
  185. <category><![CDATA[Ambiq]]></category>
  186. <category><![CDATA[Artificial Intelligence (AI)]]></category>
  187. <category><![CDATA[Infineon]]></category>
  188. <category><![CDATA[machine learning]]></category>
  189. <category><![CDATA[MCU]]></category>
  190. <guid isPermaLink="false">https://www.eetimes.com/?p=1414932</guid>
  191. <description>
  192. <![CDATA[<p>Sending data back to the cloud is no longer practical for many edge AI/ML workloads.</p>
  193. <p>The post <a href="https://www.eetimes.com/smarter-mcus-keep-ai-at-the-edge/">Smarter MCUs Keep AI at the Edge</a> appeared first on <a href="https://www.eetimes.com">EE Times</a>.</p>
  194. ]]>
  195. </description>
  196.  
  198. <content:encoded>
  199. <![CDATA[<p>As the edge gets smarter, the challenge becomes increasing machine learning (ML) and inference without spiking power consumption—microcontrollers (MCUs) optimized for edge AI applications are important</p>]]>
  200. </content:encoded>
  202. <dc:language>en-US</dc:language>
  203.  
  204. <media:thumbnail url="https://www.eetimes.com/wp-content/uploads/AdobeStock_507662376_homepage.jpeg" />
  206. <wfw:commentRss>https://www.eetimes.com/smarter-mcus-keep-ai-at-the-edge/feed/</wfw:commentRss>
  207. <slash:comments>0</slash:comments>
  210. <post-id xmlns="com-wordpress:feed-additions:1">1414932</post-id> </item>
  211. <item>
  212. <title>Is AI the Killer Application for Silicon Photonics?</title>
  213. <link>https://www.eetimes.com/is-ai-the-killer-application-for-silicon-photonics/</link>
  214.  
  215. <comments>https://www.eetimes.com/is-ai-the-killer-application-for-silicon-photonics/#respond</comments>
  217. <dc:creator>
  218. <![CDATA[Nitin Dahad]]>
  219. </dc:creator>
  220. <pubDate>Wed, 01 May 2024 13:00:49 +0000</pubDate>
  221. <category><![CDATA[Blog]]></category>
  222. <category><![CDATA[AI and Big Data]]></category>
  223. <category><![CDATA[Silicon Photonics]]></category>
  224. <guid isPermaLink="false"></guid>
  225. <description>
  226. <![CDATA[<p>We are at a potential turning point for silicon photonics.</p>
  227. <p>The post <a href="https://www.eetimes.com/is-ai-the-killer-application-for-silicon-photonics/">Is AI the Killer Application for Silicon Photonics?</a> appeared first on <a href="https://www.eetimes.com">EE Times</a>.</p>
  228. ]]>
  229. </description>
  230.  
  232. <content:encoded>
  233. <![CDATA[<p>Is AI the killer application that will enable widespread adoption of silicon photonics? One would think so, given the explosive growth in AI over the last couple of years driving the need for high-speed</p>]]>
  234. </content:encoded>
  236. <dc:language>en-US</dc:language>
  237.  
  238. <media:thumbnail url="https://www.eetimes.com/wp-content/uploads/Soitec-workshop-San-Diego-image.jpeg" />
  240. <wfw:commentRss>https://www.eetimes.com/is-ai-the-killer-application-for-silicon-photonics/feed/</wfw:commentRss>
  241. <slash:comments>0</slash:comments>
  244. <post-id xmlns="com-wordpress:feed-additions:1">1414992</post-id> </item>
  245. <item>
  246. <title>SK Hynix Boosting HBM Output with $14.6 Billion Investment</title>
  247. <link>https://www.eetimes.com/sk-hynix-boosting-hbm-output-with-14-6-billion-investment/</link>
  248.  
  249. <comments>https://www.eetimes.com/sk-hynix-boosting-hbm-output-with-14-6-billion-investment/#respond</comments>
  251. <dc:creator>
  252. <![CDATA[Alan Patterson]]>
  253. </dc:creator>
  254. <pubDate>Tue, 30 Apr 2024 18:00:00 +0000</pubDate>
  255. <category><![CDATA[News]]></category>
  256. <category><![CDATA[Memory]]></category>
  257. <guid isPermaLink="false">https://www.eetimes.com/?p=1414970</guid>
  258. <description>
  259. <![CDATA[<p>The company recently announced an advanced-packaging project in the U.S. for HBM.</p>
  260. <p>The post <a href="https://www.eetimes.com/sk-hynix-boosting-hbm-output-with-14-6-billion-investment/">SK Hynix Boosting HBM Output with $14.6 Billion Investment</a> appeared first on <a href="https://www.eetimes.com">EE Times</a>.</p>
  261. ]]>
  262. </description>
  263.  
  265. <content:encoded>
  266. <![CDATA[<p>SK Hynix, the world’s leading producer of high-bandwidth memory (HBM) that speeds the performance of AI chips, plans to invest more than ₩20 trillion ($14.6 billion) in a new fab in South Korea.</p>
  267. <p>In a</p>]]>
  268. </content:encoded>
  270. <dc:language>en-US</dc:language>
  271.  
  272. <media:thumbnail url="https://www.eetimes.com/wp-content/uploads/Artist-rendition-of-SK-Hynix-fab-e1714405179834.jpg" />
  274. <wfw:commentRss>https://www.eetimes.com/sk-hynix-boosting-hbm-output-with-14-6-billion-investment/feed/</wfw:commentRss>
  275. <slash:comments>0</slash:comments>
  278. <post-id xmlns="com-wordpress:feed-additions:1">1414970</post-id> </item>
  279. <item>
  280. <title>World’s Biggest Neuromorphic Computer Can Run Deep Learning</title>
  281. <link>https://www.eetimes.com/worlds-biggest-neuromorphic-computer-can-run-deep-learning/</link>
  282.  
  283. <comments>https://www.eetimes.com/worlds-biggest-neuromorphic-computer-can-run-deep-learning/#respond</comments>
  285. <dc:creator>
  286. <![CDATA[Sally Ward-Foxton]]>
  287. </dc:creator>
  288. <pubDate>Tue, 30 Apr 2024 13:00:26 +0000</pubDate>
  289. <category><![CDATA[News]]></category>
  290. <category><![CDATA[AI and Big Data]]></category>
  291. <guid isPermaLink="false">https://www.eetimes.com/?p=1414978</guid>
  292. <description>
  293. <![CDATA[<p>Hala Point will run inference for both brain-inspired SNNs and mainstream DNNs.</p>
  294. <p>The post <a href="https://www.eetimes.com/worlds-biggest-neuromorphic-computer-can-run-deep-learning/">World’s Biggest Neuromorphic Computer Can Run Deep Learning</a> appeared first on <a href="https://www.eetimes.com">EE Times</a>.</p>
  295. ]]>
  296. </description>
  297.  
  299. <content:encoded>
  300. <![CDATA[<p>The world’s biggest neuromorphic computer has been commissioned by Sandia National Labs. Hala Point will use 1152 Intel second-generation Loihi 2 chips for a total of 1.15 billion neurons. It will run</p>]]>
  301. </content:encoded>
  303. <dc:language>en-US</dc:language>
  304.  
  305. <media:thumbnail url="https://www.eetimes.com/wp-content/uploads/Intel-Hala-Point-Team-sq.jpg" />
  307. <wfw:commentRss>https://www.eetimes.com/worlds-biggest-neuromorphic-computer-can-run-deep-learning/feed/</wfw:commentRss>
  308. <slash:comments>0</slash:comments>
  311. <post-id xmlns="com-wordpress:feed-additions:1">1414978</post-id> </item>
  312. <item>
  313. <title>Microchip Drives Chip Innovation With TSMC, AI Advancements</title>
  314. <link>https://www.eetimes.com/microchip-drives-chip-innovation-with-tsmc-ai-advancements/</link>
  315.  
  316. <comments>https://www.eetimes.com/microchip-drives-chip-innovation-with-tsmc-ai-advancements/#respond</comments>
  318. <dc:creator>
  319. <![CDATA[Maurizio Di Paolo Emilio]]>
  320. </dc:creator>
  321. <pubDate>Mon, 29 Apr 2024 18:00:18 +0000</pubDate>
  322. <category><![CDATA[News]]></category>
  323. <category><![CDATA[SoC]]></category>
  324. <guid isPermaLink="false">https://www.eetimes.com/?p=1414944</guid>
  325. <description>
  326. <![CDATA[<p>Microchip's advancements showcase its commitment to innovation and supply chain resilience. </p>
  327. <p>The post <a href="https://www.eetimes.com/microchip-drives-chip-innovation-with-tsmc-ai-advancements/">Microchip Drives Chip Innovation With TSMC, AI Advancements</a> appeared first on <a href="https://www.eetimes.com">EE Times</a>.</p>
  328. ]]>
  329. </description>
  330.  
  332. <content:encoded>
  333. <![CDATA[<p>Microchip Technology has announced two significant developments showcasing its commitment to innovation and supply chain resilience. Firstly, the company has expanded its partnership with Taiwan</p>]]>
  334. </content:encoded>
  336. <dc:language>en-US</dc:language>
  337.  
  338. <media:thumbnail url="https://www.eetimes.com/wp-content/uploads/fab12inc023-584-0-002-mrt389200-e1714159146246.jpg" />
  340. <wfw:commentRss>https://www.eetimes.com/microchip-drives-chip-innovation-with-tsmc-ai-advancements/feed/</wfw:commentRss>
  341. <slash:comments>0</slash:comments>
  344. <post-id xmlns="com-wordpress:feed-additions:1">1414944</post-id> </item>
  345. <item>
  346. <title>TSMC’s A16 Process Moves Goalposts in Tech-Leadership Game</title>
  347. <link>https://www.eetimes.com/tsmcs-a16-process-moves-goalposts-in-tech-leadership-game/</link>
  348.  
  349. <comments>https://www.eetimes.com/tsmcs-a16-process-moves-goalposts-in-tech-leadership-game/#respond</comments>
  351. <dc:creator>
  352. <![CDATA[Alan Patterson]]>
  353. </dc:creator>
  354. <pubDate>Mon, 29 Apr 2024 12:00:03 +0000</pubDate>
  355. <category><![CDATA[News]]></category>
  356. <category><![CDATA[SoC]]></category>
  357. <guid isPermaLink="false">https://www.eetimes.com/?p=1414951</guid>
  358. <description>
  359. <![CDATA[<p>The world’s leading chip foundry in April announced plans to roll out its newest process A16 chips by 2026.</p>
  360. <p>The post <a href="https://www.eetimes.com/tsmcs-a16-process-moves-goalposts-in-tech-leadership-game/">TSMC’s A16 Process Moves Goalposts in Tech-Leadership Game</a> appeared first on <a href="https://www.eetimes.com">EE Times</a>.</p>
  361. ]]>
  362. </description>
  363.  
  365. <content:encoded>
  366. <![CDATA[<p>Taiwan Semiconductor Manufacturing Co. (TSMC) has changed the tech leadership game with the announcement of its latest A16 chipmaking process, which analysts say may be a leap ahead of Intel’s 18A node.</p>]]>
  367. </content:encoded>
  369. <dc:language>en-US</dc:language>
  370.  
  371. <media:thumbnail url="https://www.eetimes.com/wp-content/uploads/AdobeStock_467822898_Editorial_Use_Only-e1714166530302.jpeg" />
  373. <wfw:commentRss>https://www.eetimes.com/tsmcs-a16-process-moves-goalposts-in-tech-leadership-game/feed/</wfw:commentRss>
  374. <slash:comments>0</slash:comments>
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  380.    

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